3D-IC Thermal Design
Fast thermal simulation for early-stage 3D-IC design, hotspot prediction, and cooling optimization.
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Advancing scientific discovery through simulation and artificial intelligence.
最終更新 / Last updated 2026-03-27 17:20 JST
Fast thermal simulation for early-stage 3D-IC design, hotspot prediction, and cooling optimization.
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A scalable parallel Tensor-Train Decomposition method for efficiently compressing and analyzing massive multidimensional data.
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Data-driven discovery of mathematical models for physical phenomena.
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Scalable iterative solvers for large-scale sparse matrices.
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