High-Throughput Thermal Simulation for Early-Stage 3D-IC Design Using Automated Meshing and Pseudo-3D Modeling

Authors: Kenji Ono, Takanori Iwasaki, Takeshi Ohkawa

Conference: 2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

URL: https://www.impact.org.tw/site/mypage.aspx?pid=305&lang=en&sid=1283

Peer Review: Refereed