BibTeX: High-Throughput Thermal Simulation for Early-Stage 3D-IC Design Using Automated Meshing and Pseudo-3D Modeling

BibTeX source

@inproceedings{impact:25,
  title = {High-Throughput Thermal Simulation for Early-Stage 3D-IC Design Using Automated Meshing and Pseudo-3D Modeling},
  author = {Kenji Ono, Takanori Iwasaki, Takeshi Ohkawa},
  booktitle = {2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)},
  publisher = {},
  year = {2025},
  month = {October},
  volume = {},
  pages = {},
  doi = {},
  url = {https://www.impact.org.tw/site/mypage.aspx?pid=305&lang=en&sid=1283},
  abstract = {},
  peer_reviewed = {true},
  address = {Taipei, Taiwan},
  issn = {},
  keywords = {},
}